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[IEEE 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Kyoto, Japan (2015.4.14-2015.4.17)] 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Effect of ion species for the surface activated bonding of GaAs wafers on the characteristics of the bonded interfaces
Kono, Genki, Fujino, Masahisa, Yamashita, Daiji, Watanabe, Kentaroh, Sugiyama, Masakazu, Nakano, Yoshiaki, Suga, TadatomoYear:
2015
Language:
english
DOI:
10.1109/ICEP-IAAC.2015.7111062
File:
PDF, 7.04 MB
english, 2015