Precision depth measurement of through silicon vias (TSVs)...

Optics Express 2012 / 02 Vol. 20; Iss. 5

Precision depth measurement of through silicon vias (TSVs) on 3D semiconductor packaging process

Jin, Jonghan, Kim, Jae Wan, Kang, Chu-Shik, Kim, Jong-Ahn, Lee, Sunghun
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
20
Language:
english
Journal:
Optics Express
DOI:
10.1364/OE.20.005011
Date:
February, 2012
File:
PDF, 922 KB
english, 2012
Conversion to is in progress
Conversion to is failed