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[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - The effects of Au film thickness on the reliability of Sn-Pb solder joints
Lv, Xiaorui, Lin, Pengrong, Huang, Yingzhuo, Jiang, Xueming, Lian, Binhao, Yao, QuanbinYear:
2015
Language:
english
DOI:
10.1109/ICEPT.2015.7236822
File:
PDF, 533 KB
english, 2015