Assembly and Packaging Technologies for High-Temperature...

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IEEE Transactions on Components Packaging and Manufacturing Technology 2015

Assembly and Packaging Technologies for High-Temperature and High-Power GaN Devices

Bajwa, Adeel Ahmad, Qin, Yangyang, Reiner, Richard, Quay, Rudiger, Wilde, Jurgen
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Year:
2015
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2015.2468595
File:
PDF, 3.86 MB
english, 2015
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