[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Ultra-miniaturized and surface-mountable glass-based 3D IPAC packages for RF modules
Sato, Yoichiro, Sitaraman, Srikrishna, Sukumaran, Vijay, Chou, Bruce, Min, Junki, Ono, Motoshi, Karoui, Choukri, Dosseul, Franck, Nopper, Christian, Swaminathan, Madhavan, Sundaram, Venky, Tummala, RaYear:
2013
Language:
english
DOI:
10.1109/ECTC.2013.6575795
File:
PDF, 1.30 MB
english, 2013