Influence of nano-SiO2/copper electroless composite plating...

Journal of Materials Science: Materials in Electronics 2015 / 11 Vol. 26; Iss. 11

Influence of nano-SiO2/copper electroless composite plating on morphologies and properties of Cu thick films on Al2O3

Zhang, Pengfei, Fu, Renli, Jiang, Weina, Cao, Bing, Tang, Ye
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Volume:
26
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-015-3501-6
Date:
November, 2015
File:
PDF, 1.70 MB
english, 2015
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