Impact of aluminum wire and ribbon bonding technologies on D2PAK package reliability during thermal cycling applications
Jacques, S., Leroy, R., Lethiecq, M.Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2015.06.012
Date:
June, 2015
File:
PDF, 1.11 MB
english, 2015