Indirect Contact Probing Method for Characterizing Vertical...

IEEE Microwave and Wireless Components Letters 2015 / 1 Vol. 25; Iss. 1

Indirect Contact Probing Method for Characterizing Vertical Interconnections in Electronic Packaging

Jeong, Jongwoo, Kim, Jingook, Kang, No-Weon, Han, Ki Jin
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Volume:
25
Language:
english
Journal:
IEEE Microwave and Wireless Components Letters
DOI:
10.1109/LMWC.2014.2369951
Date:
January, 2015
File:
PDF, 657 KB
english, 2015
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