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Fast atom bombardment onto vertically aligned multi-walled carbon nanotube bumps to achieve low interconnect resistance with Au layer
Fujino, Masahisa, Soga, Ikuo, Kondo, Daiyu, Ishizuki, Yoshikatsu, Iwai, Taisuke, Suga, TadatomoLanguage:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2015.09.004
Date:
September, 2015
File:
PDF, 2.17 MB
english, 2015