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Recovery of microstructure and surface topography of grinding-damaged silicon wafers by nanosecond-pulsed laser irradiation
Yan, Jiwang, Sakai, Shin, Isogai, Hiromichi, Izunome, KojiVolume:
24
Language:
english
Journal:
Semiconductor Science and Technology
DOI:
10.1088/0268-1242/24/10/105018
Date:
October, 2009
File:
PDF, 1.68 MB
english, 2009