A novel method for nanoprecision alignment in wafer bonding applications
Jiang, Liudi, Pandraud, G, French, P J, Spearing, S M, Kraft, MVolume:
17
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/17/7/S01
Date:
July, 2007
File:
PDF, 719 KB
english, 2007