A novel method for nanoprecision alignment in wafer bonding...

A novel method for nanoprecision alignment in wafer bonding applications

Jiang, Liudi, Pandraud, G, French, P J, Spearing, S M, Kraft, M
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Volume:
17
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/17/7/S01
Date:
July, 2007
File:
PDF, 719 KB
english, 2007
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