A wafer-scale packaging structure with monolithic microwave...

A wafer-scale packaging structure with monolithic microwave integrated circuits and passives embedded in a silicon substrate for multichip modules for radio frequency applications

Geng, Fei, Ding, Xiao-yun, Xu, Gao-wei, Luo, Le
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Volume:
19
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/19/10/105011
Date:
October, 2009
File:
PDF, 2.60 MB
english, 2009
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