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Void nucleation at a sequentially plasma-activated silicon/silicon bonded interface
Howlader, M M R, Zhang, F, Kibria, M GVolume:
20
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/20/6/065012
Date:
June, 2010
File:
PDF, 2.39 MB
english, 2010