Development of a self-packaged 2D MEMS thermal wind sensor for low power applications
Zhu, Yan-qing, Chen, Bei, Qin, Ming, Huang, Jian-qiu, Huang, Qing-anVolume:
25
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/25/8/085011
Date:
August, 2015
File:
PDF, 2.63 MB
english, 2015