Heat-driven liquid metal cooling device for the thermal...

Heat-driven liquid metal cooling device for the thermal management of a computer chip

Ma, Kun-Quan, Liu, Jing
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Volume:
40
Language:
english
Journal:
Journal of Physics D: Applied Physics
DOI:
10.1088/0022-3727/40/15/055
Date:
August, 2007
File:
PDF, 176 KB
english, 2007
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