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Wettability and Bond Shear Strength of Sn-9Zn Lead-Free Solder Alloy Reflowed on Copper Substrate
Tikale, Sanjay, Sona, Mrunali, Prabhu, K.N.Volume:
830-831
Language:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.830-831.215
Date:
September, 2015
File:
PDF, 908 KB
english, 2015