Capacitance Expressions and Electrical Characterization of...

IEEE Transactions on Components Packaging and Manufacturing Technology 2015 / 10 Vol. 5; Iss. 10

Capacitance Expressions and Electrical Characterization of Tapered Through- Silicon Vias for 3-D ICs

Su, Jinrong, Wang, Fang, Zhang, Wenmei
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Volume:
5
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2015.2457938
Date:
October, 2015
File:
PDF, 2.37 MB
english, 2015
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