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[IEEE 2013 10th China International Forum on Solid State Lighting (ChinaSSL) - Beijing, China (2013.11.10-2013.11.12)] 2013 10th China International Forum on Solid State Lighting (ChinaSSL) - Thermal behavior of flip chip LED packages using electrical conductive adhesive and soldering methods
Liu, Yang, Guoqi Zhang,, Sun, Fenglian, Xuejun Fan,, Wong, Cell K.Y., Yuan, Cadmus A., Tuo Zheng,, Chao Huang,, Chenglong Zheng,, Hongyu Tang,Year:
2013
DOI:
10.1109/SSLCHINA.2013.7177300
File:
PDF, 965 KB
2013