Encapsulant materials systems for flip‐chip‐on‐board...

Circuit World 1998 / 01 Vol. 24; Iss. 1

Encapsulant materials systems for flip‐chip‐on‐board assemblies: addressing manufacturing issues

Gamota, Daniel R., Melton, Cindy M.
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Volume:
24
Language:
english
Journal:
Circuit World
DOI:
10.1108/030561201998000001
Date:
January, 1998
File:
PDF, 90 KB
english, 1998
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