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Demonstration and Electrical Performance of Cu–Cu Bonding at 150 °C With Pd Passivation
Huang, Yan-Pin, Chien, Yu-San, Tzeng, Ruoh-Ning, Chen, Kuan-NengVolume:
62
Language:
english
Journal:
IEEE Transactions on Electron Devices
DOI:
10.1109/TED.2015.2446507
Date:
August, 2015
File:
PDF, 1.36 MB
english, 2015