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[IEEE 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Kyoto, Japan (2015.4.14-2015.4.17)] 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Effect of Au nanoporous structure on bonding strength
Matsunaga, Kaori, Kim, Min-Su, Nishikawa, Hiroshi, Saito, Mikiko, Mizuno, JunYear:
2015
Language:
english
DOI:
10.1109/ICEP-IAAC.2015.7111127
File:
PDF, 563 KB
english, 2015