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Solder Joint Reliability of Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys Solidified on Copper Substrates with Different Surface Roughnesses
Satyanarayan,, Prabhu, K.N.Volume:
830-831
Language:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.830-831.265
Date:
September, 2015
File:
PDF, 325 KB
english, 2015