[IEEE 2014 Symposium on Design, Test, Integration and...

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[IEEE 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - Cannes, France (2014.4.1-2014.4.4)] 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - Long-term investigations of RF-MEMS switches on failure mechanisms induced by dielectric charging

Behielt, Regine, Kunzig, Thomas, Schrag, Gabriele
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Year:
2014
Language:
english
DOI:
10.1109/DTIP.2014.7056675
File:
PDF, 462 KB
english, 2014
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