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[IEEE 2014 IEEE 36th International Electronics Manufacturing Technology Conference (IEMT) - Johor, Malaysia (2014.11.11-2014.11.13)] 36th International Electronics Manufacturing Technology Conference - Addition of porous Cu interlayer to Sn-3.0Ag-0.5Cu lead-free solder joint for high temperature application
Jamadon, Nashrah Hani, Yusof, Farazila, Shukor, Mohd Hamdi Abd, Ariga, Tadashi, Miyashita, YukioYear:
2014
Language:
english
DOI:
10.1109/IEMT.2014.7123096
File:
PDF, 2.30 MB
english, 2014