[IEEE 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Budapest, Hungary (2015.4.19-2015.4.22)] 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Prediction of package delamination based on μMMT and BST experiments
Nabi, Hasan Sadat, Schweitzer, Dirk, Duc-Khoi Vu,, Maus, Ingrid, Weiss, LaurensYear:
2015
Language:
english
DOI:
10.1109/EuroSimE.2015.7103107
File:
PDF, 1.36 MB
english, 2015