Analysis of Temperature Distribution in Stacked IC With...

IEEE Transactions on Semiconductor Manufacturing 2015 / 8 Vol. 28; Iss. 3

Analysis of Temperature Distribution in Stacked IC With On-Chip Sensing Device Arrays

Matsuda, Toshihiro, Yamada, Keita, Demachi, Haruka, Iwata, Hideyuki, Hatakeyama, Tomoyuki, Ishizuka, Masaru, Ohzone, Takashi
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Volume:
28
Language:
english
Journal:
IEEE Transactions on Semiconductor Manufacturing
DOI:
10.1109/TSM.2015.2408434
Date:
August, 2015
File:
PDF, 2.37 MB
english, 2015
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