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Effects of Mold Geometries and Initial Resist Thickness on Filling Behavior in UV-Nanoimprint Lithography
Du, Jun, Wei, Zhengying, He, Wei, Tang, YipingVolume:
9
Language:
english
Journal:
Journal of Computational and Theoretical Nanoscience
DOI:
10.1166/jctn.2012.2136
Date:
August, 2012
File:
PDF, 3.54 MB
english, 2012