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Development and characterization of Sn–1.3Ag–0.7Cu solder bearing Zn for electronic packaging
El-Daly, A. A., Radwan, N., Abo El-Eizz, H. M., Hamza, B. A.Volume:
26
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-015-3561-7
Date:
November, 2015
File:
PDF, 3.29 MB
english, 2015