[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Development of structure function analysis system for power semiconductor devices
Que, Xiufu, Liu, Yanan, Yang, Lianqiao, Chen, Wei, Zhang, JianhuaYear:
2015
Language:
english
DOI:
10.1109/ICEPT.2015.7236696
File:
PDF, 2.12 MB
english, 2015