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[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Electrical performance of isotropic conductive adhesives with copper and copper coated iron fillers
Liu, Junpeng, Redei, Richard, Qi, Siyuan, Hutt, David A., Whalley, DavidYear:
2014
Language:
english
DOI:
10.1109/EPTC.2014.7028407
File:
PDF, 576 KB
english, 2014