Microstructure and electrical property of copper films on a...

Journal of Materials Science: Materials in Electronics 2015 / 11 Vol. 26; Iss. 11

Microstructure and electrical property of copper films on a flexible substrate formed by an organic ink with 9.6 % of Cu content

Yang, Wen-dong, Wang, Chang-hai, Arrighi, Valeria, Liu, Chun-yan, Watson, David
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Volume:
26
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-015-3580-4
Date:
November, 2015
File:
PDF, 2.60 MB
english, 2015
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