Interfacial morphology and grain orientation during...

  • Main
  • 2015 / 10
  • Interfacial morphology and grain orientation during...
Thin Solid Films 2015 / 10

Interfacial morphology and grain orientation during bumpless direct Cu bonding

Liu, Ziyu, Cai, Jian, Wang, Qian
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Language:
english
Journal:
Thin Solid Films
DOI:
10.1016/j.tsf.2015.10.051
Date:
October, 2015
File:
PDF, 915 KB
english, 2015
Conversion to is in progress
Conversion to is failed