Microstructure, thermal behavior, and wettability of...

Journal of Materials Science: Materials in Electronics 2015 / 10 Vol. 26; Iss. 10

Microstructure, thermal behavior, and wettability of Zn4Al3Mg–xIn solders

Yan, Xin, Yang, Xiaojun, Hu, Wei, Lei, Yongping
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Volume:
26
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-015-3390-8
Date:
October, 2015
File:
PDF, 2.14 MB
english, 2015
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