Thermally stable high temperature die attach solution

Materials & Design 2015 / 10

Thermally stable high temperature die attach solution

Amir Paknejad, S., Mansourian, Ali, Noh, Yohan, Khtatba, Khalid, Mannan, Samjid H.
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Language:
english
Journal:
Materials & Design
DOI:
10.1016/j.matdes.2015.10.074
Date:
October, 2015
File:
PDF, 1.30 MB
english, 2015
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