Formation of plate-like channels in Cu6Sn5 and Cu3Sn...

Materials Letters 2016 / 02 Vol. 164

Formation of plate-like channels in Cu6Sn5 and Cu3Sn intermetallic compounds during transient liquid reaction of Cu/Sn/Cu structures

Chiu, Wei-Lan, Liu, Chien-Min, Haung, Yi-Sa, Chen, Chih
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Volume:
164
Language:
english
Journal:
Materials Letters
DOI:
10.1016/j.matlet.2015.10.056
Date:
February, 2016
File:
PDF, 1.02 MB
english, 2016
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