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Low Temperature Cu-Cu Bonding Using Ag Nanostructure for 3D Integration
Liu, Ziyu, Cai, Jian, Wang, Qian, Tan, Lin, Hu, YangLanguage:
english
Journal:
Materials Letters
DOI:
10.1016/j.matlet.2015.10.123
Date:
October, 2015
File:
PDF, 1.27 MB
english, 2015