[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Fan-out technologies for WiFi SiP module packaging and electrical performance simulation
Hsieh, Chueh An, Tsai, Chung Hsuan, Lee, Huan Wun, Lee, Tony YC, Chang, HarrisonYear:
2015
Language:
english
DOI:
10.1109/ECTC.2015.7159820
File:
PDF, 2.15 MB
english, 2015