Thermal Stability of Atomic Layer Deposited Ru Layer on Si...

Thermal Stability of Atomic Layer Deposited Ru Layer on Si and TaN/Si for Barrier Application of Cu Interconnection

Shin, Dong Chan, Kim, Moo Ryul, Lee, Jong Ho, Choi, Bum Ho, Lee, Hong Kee
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Volume:
12
Language:
english
Journal:
Journal of Nanoscience and Nanotechnology
DOI:
10.1166/jnn.2012.6312
Date:
July, 2012
File:
PDF, 2.63 MB
english, 2012
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