Thermal Stability of Atomic Layer Deposited Ru Layer on Si and TaN/Si for Barrier Application of Cu Interconnection
Shin, Dong Chan, Kim, Moo Ryul, Lee, Jong Ho, Choi, Bum Ho, Lee, Hong KeeVolume:
12
Language:
english
Journal:
Journal of Nanoscience and Nanotechnology
DOI:
10.1166/jnn.2012.6312
Date:
July, 2012
File:
PDF, 2.63 MB
english, 2012