Thermal reliability prediction and analysis for...

Microelectronics Reliability 2015 / 10

Thermal reliability prediction and analysis for high-density electronic systems based on the Markov process

Wan, Yi, Huang, Hailong, Das, Diganta, Pecht, Michael
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Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2015.10.006
Date:
October, 2015
File:
PDF, 1.45 MB
english, 2015
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