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Stress Behavior of FCC Metallic Thin Films During Thermal Evaporation
Ryu, Sang, Lee, Kyungchun, Ma, Seungwhan, Kim, YoungmanVolume:
7
Language:
english
Journal:
Journal of Nanoscience and Nanotechnology
DOI:
10.1166/jnn.2007.089
Date:
November, 2007
File:
PDF, 222 KB
english, 2007