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Research on adhesive layer depth and frequency in weak interface of bonded structures
Zhaoguo, Qiu, Bin, Wu, Cunfu, HeVolume:
53
Language:
english
Journal:
Insight - Non-Destructive Testing and Condition Monitoring
DOI:
10.1784/insi.2011.53.6.302
Date:
June, 2011
File:
PDF, 4.42 MB
english, 2011