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Analysis of solder joint reliability of high power LEDs by transient thermal testing and transient finite element simulations
Elger, Gordon, Kandaswamy, Shri Vishnu, Liu, E., Hanss, Alexander, Schmid, Maximilian, Derix, Robert, Conti, FoscaLanguage:
english
Journal:
Microelectronics Journal
DOI:
10.1016/j.mejo.2015.08.007
Date:
September, 2015
File:
PDF, 4.04 MB
english, 2015