The die-to-die calibrated combined model of negative bias...

Microelectronics Reliability 2015 / 08 Vol. 55; Iss. 9-10

The die-to-die calibrated combined model of negative bias temperature instability and gate oxide breakdown from device to system

Cha, Soonyoung, Kim, Dae-Hyun, Liu, Taizhi, Milor, Linda S.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
55
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2015.06.105
Date:
August, 2015
File:
PDF, 2.95 MB
english, 2015
Conversion to is in progress
Conversion to is failed