Top-down delayering to expose large inspection area on die...

Microelectronics Reliability 2015 / 08 Vol. 55; Iss. 9-10

Top-down delayering to expose large inspection area on die side-edge with Platinum (Pt) deposition technique

Yap, H.H., Tan, P.K., Low, G.R., Dawood, M.K., Feng, H., Zhao, Y.Z., He, R., Tan, H., Zhu, J., Liu, B., Huang, Y.M., Wang, D.D., Lam, J., Mai, Z.H.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
55
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2015.06.037
Date:
August, 2015
File:
PDF, 2.17 MB
english, 2015
Conversion to is in progress
Conversion to is failed