Corrosion behavior of electroless nickel/immersion gold plating by interfacial morphology
Lee, Dong-Jun, Huh, Seok-Hwan, Kim, Chi-Seong, Mun, Seongjae, Shin, Han-Kyun, Lee, Hyo-JongVolume:
11
Language:
english
Journal:
Electronic Materials Letters
DOI:
10.1007/s13391-015-4446-x
Date:
July, 2015
File:
PDF, 2.39 MB
english, 2015