Formation and evolution of intermetallic compounds between the In-3Ag solder and Cu substrate during soldering
Ma, Yunzhu, Luo, Huiting, Li, Yongjun, Liu, Wensheng, Wang, Yikai, Huang, BoyunVolume:
26
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-015-3451-z
Date:
October, 2015
File:
PDF, 3.90 MB
english, 2015