Effects of Bi addition on interfacial reactions and mechanical properties of In–3Ag–xBi/Cu solder joints
Ma, Yunzhu, Luo, Huiting, Liu, Wensheng, Huang, Yufeng, Yu, Qiang, Li, YongjunVolume:
27
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-015-3724-6
Date:
January, 2016
File:
PDF, 2.09 MB
english, 2016