Sequential Lateral Solidification of Silicon Thin Films on...

IEEE Transactions on Electron Devices 2015 / 11 Vol. 62; Iss. 11

Sequential Lateral Solidification of Silicon Thin Films on Cu BEOL-Integrated Wafers for Monolithic 3-D Integration

Carta, Fabio, Gates, Stephen M., Limanov, Alexander B., Im, James S., Edelstein, Daniel C., Kymissis, Ioannis
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Volume:
62
Language:
english
Journal:
IEEE Transactions on Electron Devices
DOI:
10.1109/TED.2015.2479087
Date:
November, 2015
File:
PDF, 3.30 MB
english, 2015
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