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[IEEE 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Kyoto, Japan (2015.4.14-2015.4.17)] 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Estimation method of cracking probability of stacked overhang die during wire bonding
Sawada, Kanako, Aoki, Hideo, Matsuura, Eigo, Mukaida, Hideko, Minami, FumiyoshiYear:
2015
Language:
english
DOI:
10.1109/ICEP-IAAC.2015.7111115
File:
PDF, 1.22 MB
english, 2015