![](/img/cover-not-exists.png)
[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Parallel gap resistance thick wire bonding for vertical interconnection in 3D assembly
Guo, Xuguang, Tian, Yanhong, Wang, Shang, Wang, ChunqingYear:
2014
Language:
english
DOI:
10.1109/ICEPT.2014.6922553
File:
PDF, 631 KB
english, 2014